2017 SMT Hybrid Packaging 2017/5/16-5/18

会期: 2017年5月16日[火]~18日[木]
会場: NurnbergMesse
小間番号:4-331



SMT Hybrid Packaging is the only event in Europe which takes a comprehensive view of System intergration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.
The exhibition and conference shows the complete spectrum on System Integration in Micro Electronics. This international meeting point in the field of electronic manufacturing offers the latest products, services and solutions - the complete market overview under one roof.

Key topics:
Technologies and Processes
Materials and Components
Manufacturing
Manufacturing equipment
Reliability and Test
Software and Systems
Service and Consulting


2017/04/18 15:09
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